The UNM MTTC Cleanroom supports several microfabrication and MEMS processes, including
- photolithography steps (resist spinning, softbake (hotplate/Blue M oven), contact exposure, bath developing, spin rinse drying, hardbake),
- wet etch (dedicated KOH, SC1, SC2 and HF baths),
- solvent /acid cleaning,
- RIE plasma etch (single wafer), Deep Reactive Ion Etching (DRIE, Alcatel model AMS-100-SDE),
- Parylene coating,
- diffusion processing (oxidation wet and dry, N-Dope and drive, P-Dope and drive, LPCVD silicon nitride deposition, LPCVD polysilicon deposition, LPCVD oxide deposition),
- vacuum evaporator, five-source reactive-gas sputter system, E-Beam cure, forming gas diffusion,
- CO2 critical dryer, ADT wafer dicer,
- metrology (film thickness measurement, four-point probe, interferometer, microscopes, contact profilometer, and Phenom desktop SEM).
For a full list of available equipment and usage rates click here -
